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Intel(R) AtomTM Processor 230 Series
Datasheet April 2010
Document Number: 319977-003
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Contents
1 Introduction .....................................................................................................6 1.1 1.2 1.3 2 Intel(R) AtomTM Processor 230 Series Features .............................................6 Terminology ..........................................................................................7 Reference Documents .............................................................................8
Low Power Features ..........................................................................................9 2.1 Clock Control and Low-power States .........................................................9 2.1.1 Thread Low-power State Descriptions ......................................... 10 2.1.2 Package Low-power State Descriptions ....................................... 11 2.1.3 Front Side Bus ........................................................................ 11 FSB and GTLREF .................................................................................. 12 Power and Ground Pins ......................................................................... 12 Decoupling Guidelines ........................................................................... 12 3.3.1 VCCP Decoupling ..................................................................... 13 3.3.2 FSB AGTL+ Decoupling ............................................................ 13 Voltage Identification and Power Sequencing ............................................ 13 Catastrophic Thermal Protection ............................................................. 15 Reserved and Unused Pins ..................................................................... 15 FSB Frequency Select Signals (BSEL[2:0]) ............................................... 16 FSB Signal Groups ................................................................................ 16 CMOS Asynchronous Signals .................................................................. 17 3.10 Maximum Ratings ......................................................................... 17 Processor DC Specifications ................................................................... 18 AGTL+ FSB Specifications ...................................................................... 22
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Electrical Specifications .................................................................................... 12 3.1 3.2 3.3
3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 4
Package Mechanical Specifications and Ball Information ........................................ 23 4.1 Package Mechanical Specifications .......................................................... 23 4.1.1 Package Mechanical Drawings ................................................... 23 4.1.2 Package Loading Specifications ................................................. 24 4.1.3 Processor Mass Specifications ................................................... 24 4.1.4 Processor Pinout Assignment .................................................... 24 Signal Description ................................................................................ 30
4.2 5
Thermal Specifications and Design Considerations ............................................... 38 5.1 Thermal 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 Specifications .......................................................................... 38 Thermal Diode ........................................................................ 39 Intel(R) Thermal Monitor............................................................ 41 Digital Thermal Sensor ............................................................. 42 Out of Specification Detection ................................................... 43 PROCHOT# Signal Pin .............................................................. 43
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Debug Tools Specifications ............................................................................... 45
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Figures
Figure Figure Figure Figure 1. Thread Low-power States .....................................................................9 2. Package Mechanical Drawing ................................................................ 23 3. Pinout Diagram (Top View, Left Side) ................................................... 25 4. Pinout Diagram (Top View, Right Side) ................................................. 26
Tables
Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table Table 1. Coordination of Thread Low-power States at the Package Level ................. 10 2. Voltage Identification Definition ............................................................ 13 3. Processor VID Pin to VRD11 VID Pin Mapping .......................................... 15 4. BSEL[2:0] Encoding for BCLK Frequency ................................................ 16 5. FSB Pin Groups................................................................................... 16 6. Processor Absolute Maximum Ratings .................................................... 18 7. Voltage and Current Specifications for the Intel(R) AtomTM Processor ........... 19 8. FSB Differential BCLK Specifications ...................................................... 20 9. AGTL+/CMOS Signal Group DC Specifications ......................................... 20 10. Legacy CMOS Signal Group DC Specifications ........................................ 21 11. Open Drain Signal Group DC Specifications ........................................... 22 13. Pinout Arranged By Signal Name ......................................................... 27 14. Signal Description .............................................................................. 30 15. Power Specifications for the Processor .................................................. 39 16. Thermal Diode Interface ..................................................................... 40 17. Thermal Diode Parameters using Transistor Model ................................. 40
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Revision History
Revision Number 001 * Initial Release * Update pin-map * Add SSSE3 002 * Changed A[35:2] to A[32:2] * Changed Vboot * Changed Ron and Rodt * Removed L2 Dynamic Cache Sizing 003 * Updated Table 7: Removed dI/dt details from the table April 2010 February 2009 Description Revision Date June 2008
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Introduction
1
Introduction
The Intel(R) AtomTM Single Core processor 230 sequence is built on Hi-k 45-nanometer process technology. In Nettop'08 platform, Intel Atom Single Core processor 230 sequence supports SiS as well as Intel chipsets. This document contains electrical, mechanical and thermal specifications for the processor. Note: In this document, the Intel Atom Single Core processor 230 series will be referred to as the "processor". Intel chipsets are referred to as GMCH and ICH respectively. Note: In is document, the Intel Atom processor 200 series is replaced by Intel Atom Processor 230 Series.
1.1
Intel(R) AtomTM Processor 230 Series Features
* * * * * * * * * * * * * Available at 1.6 GHz, On die, primary 32-kB instructions cache and 24-KB write-back data cache 533-MHz Source-Synchronous front side bus (FSB) Threading enabled On-die 512-KB, 8-way L2 cache Support for IA 32-bit and Intel(R) 64 architecture Streaming SIMD Extensions 2 and 3 (SSE2 and SSE3) support Micro-FCBGA packaging technologies Thermal management support via TM1 FSB Lane Reversal for flexible routing Supports C0 and C1 states only L2 Dynamic Cache Sizing Execute Disable Bit support for enhanced security
This processor series represents a new family of processors designed from the ground- up on a ground-breaking new low-power microarchitecture. It is manufactured on industry-leading 45 nm process with Hi-K Metal Gate technology. This processor series enables a new class of simple and affordable internet-centric computers called "Entry Level Desktop Platforms" that is best suited for applications focused on internet usage models--communicate, listen, watch, play, share, and learn.
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Introduction
1.2
Terminology
Term # Definition A "#" symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the "#" symbol implies that the signal is inverted. For example, D[3:0] = "HLHL" refers to a hex `A', and D[3:0]# = "LHLH" also refers to a hex "A" (H= High logic level, L= Low logic level). Front Side Bus (FSB) AGTL+ Refers to the interface between the processor and system core logic (also known as the GMCH chipset components). Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+ signaling technology on some Intel processors. CMOS Storage Conditions Complementary metal-Oxide semiconductor. Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor landings should not be connected to any supply voltages, have any I/Os biased or receive any clocks. Upon exposure to "free air" (i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. Technology that provides power management capabilities to low power devices.
Enhanced Intel SpeedStep(R) Technology Processor Core
Processor core die with integrated L1 and L2 cache. All AC timing and signal integrity specifications are at the pads of the processor core. 64-bit memory extensions to the IA-32 architecture.
Intel(R) 64 Technology Intel(R) Virtualization Technology
Processor virtualization which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single platform. Thermal Design Power The processor core power supply FSB AGTL+ termination voltage with respect to VSS Voltage Regulator The processor ground
TDP VCC VTT VR VSS
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Introduction
1.3
Reference Documents
Document Document Number www.intel.com/design/pr ocessor/specupdt/31997 8.pdf www.intel.com/design/pr ocessor/designex/31997 9.pdf http://www.intel.com/de sign/processor/applnots/ 241618.htm http://www.intel.com/de sign/processor/applnots/ 313214.htm
Intel(R) AtomTM Processors 200 Series Specification Update
Intel(R) AtomTM Processors 200 Series Thermal and Mechanical Design Guidelines AP-485, Intel(R) Processor Identification and CPUID Instruction Application Note Voltage Regulator-Down (VRD) 11.0 - Processor Power Delivery Design Guidelines Intel(R) 64 and IA-32 Architectures Software Developer's Manuals Volume 1: Basic Architecture Volume 2A: Instruction Set Reference, A-M Volume 2B: Instruction Set Reference, N-Z Volume 3A: System Programming Guide Volume 3B: System Programming Guide
http://www.intel.com/pr oducts/processor/manual s/index.htm
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Low Power Features
2
2.1
Low Power Features
Clock Control and Low-power States
The processor supports low power states at the thread level and the package level. A thread may independently enter the C1/AutoHALT and C1/MWAIT low power states. When both threads are in a common low-power state the central power management logic ensures the entire processor enters the respective package low power state by initiating a P_LVLx I/O read to the chipset. The processor implements two software interfaces for requesting low power states, MWAIT instruction extensions with sub-state hints and P_LVLx reads to the ACPI P_BLK register block mapped in the processor's I/O address space. The P_LVLx I/O reads are converted to equivalent MWAIT C-state requests inside the processor and do not directly result in I/O reads on the processor FSB. The monitor address does not need to be setup before using the P_LVLx I/O read interface. The sub-state hints used for each P_LVLx read can be configured in a software programmable MSR. Figure 2-1 shows the thread low-power states. Table 2-1 provides a mapping of thread low-power states to package low power states.
Figure 1. Thread Low-power States
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Low Power Features
Table 1. Coordination of Thread Low-power States at the Package Level
Thread State Package State2 C0 C0 C11 Normal Normal C11 Normal AutoHalt
NOTES: 1. AutoHALT or MWAIT/C1. 2. To enter a package state, both threads must be in a common low power state. If the threads are not in a common low power state, the package state will resolve to the highest power C state.
2.1.1
2.1.1.1
Thread Low-power State Descriptions
Thread C0 State
This is the normal operating state for threads in the processor.
2.1.1.2
2.1.1.2 Thread C1/AutoHALT Powerdown State
C1/AutoHALT is a low-power state entered when a thread executes the HALT instruction. The processor thread will transition to the C0 state upon occurrence of SMI#, INIT#, LINT[1:0] (NMI, INTR), or FSB interrupt messages. RESET# will cause the processor to immediately initialize itself. A System Management Interrupt (SMI) handler will return execution to either Normal state or the AutoHALT Powerdown state. See the Intel(R) 64 and IA-32 Architectures Software Developer's Manuals, Volume 3A/3B: System Programmer's Guide for more information. While in AutoHALT Powerdown state, the processor threads will process bus snoops and snoops from the other thread. The processor will enter a snoopable sub-state (not shown in Figure 2-1) to process the snoop and then return to the AutoHALT Powerdown state.
2.1.1.3
Thread C1/MWAIT Powerdown State
C1/MWAIT is a low-power state entered when the processor thread executes the MWAIT(C1) instruction. Processor behavior in the MWAIT state is identical to the AutoHALT state except that Monitor events can cause the processor to return to the C0 state. See the Intel(R) 64 and IA-32 Architectures Software Developer's Manuals, Volume 2A: Instruction Set Reference, A-M and Volume 2B: Instruction Set Reference, N-Z, for more information.
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Low Power Features
2.1.2
Package Low-power State Descriptions
Note: The following state descriptions assume that both threads are in the a common low power state. For cases when only one thread is in a low power state, please see Section 2.1.1.
2.1.2.1
Normal State
This is the normal operating state for the processor. The processor remains in the Normal state when the threads are in the C0, C1/AutoHALT, or C1/MWAIT state.
2.1.3
Front Side Bus
The Intel(R) AtomTM processor has only one signaling mode, where the data and address busses and the strobe signals are operating in GTL mode. The reason to use GTL is to improve signal integrity.
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Electrical Specifications
3
Electrical Specifications
This chapter contains signal group descriptions, absolute maximum ratings, voltage identification, and power sequencing. The chapter also includes DC specifications.
3.1
FSB and GTLREF
Intel(R) AtomTM processor supports two kinds of signaling protocol: Complementary Metal Oxide Semiconductor (CMOS), and Advanced Gunning Transceiver Logic (AGTL+). For FSB data and address bus, only AGTL+ is used. The termination voltage level for the Intel(R) AtomTM processor CMOS and AGTL+ signals is VTT = 1.10 V (nominal). Due to speed improvements to data and address bus, signal integrity and platform design methods have become more critical than with previous processor families. The CMOS sideband signals are listed in Table 3-5. The AGTL+ inputs, including the sideband signals listed in Table 3-5, require a reference voltage (GTLREF) that is used by the receivers to determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the system board. Termination resistors are provided on the processor silicon and are terminated to its I/O voltage (VTT). The appropriate chipset will also provide on-die termination, thus eliminating the need to terminate the bus on the system board for most AGTL+ signals. The AGTL+ bus depends on incident wave switching. Timing calculations for AGTL+ signals are based on flight time as opposed to capacitive deratings. Analog signal simulation of the FSB, including trace lengths, is highly recommended when designing a system.
3.2
Power and Ground Pins
For clean, on-chip power distribution, the processor will have a large number of VTT (FSB AGTL+ reference voltage), VCCP (power) and VSS (ground) inputs. All power pins must be connected to VCCP power planes while all VSS pins must be connected to system ground planes. Use of multiple power and ground planes is recommended to reduce I*R drop. The processor VCCP pins must be supplied the voltage stated in Table 3-7
3.3
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large average current swings between low and full power states. This may cause voltages on power planes to sag below their minimum values if bulk decoupling is not adequate. Larger bulk storage, supply current during longer lasting changes in current demand by the component, such as coming out of an idle condition.
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Electrical Specifications
Similarly, they act as a storage well for current when entering an idle condition from a running condition. Care must be taken in the board design to ensure that the voltage provided to the processor remains within the specifications listed in Table 3-7. Failure to do so can result in timing violations or reduced lifetime of the component. For further information and design guidelines, refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines.
3.3.1
VCCP Decoupling
VCCP regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR) and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the large current swings when the part is powering on, or entering/exiting low-power states, must be provided by the voltage regulator solution For more details on decoupling recommendations, Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines.
3.3.2
FSB AGTL+ Decoupling
The processor integrates signal termination on the die. Decoupling must also be provided by the system motherboard for proper AGTL+ bus operation.
3.4
Voltage Identification and Power Sequencing
Table 2. Voltage Identification Definition
VID6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 VID5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VID4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 VID3 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 1 VID2 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 1 1 0 VID1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 1 0 VID0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 0 VCC (V) 1.2000 1.1875 1.1750 1.1625 1.1500 1.1375 1.1250 1.1125 1.1000 1.0875 1.0750 1.0625 1.0500 1.0375 1.0250 1.0125 0.9375 0.9250 0.9125
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Electrical Specifications
VID6 0 0 0 0 0 0 0 1 1 1 1 1 1 0 0 0 0 0 1 1 1 1
VID5 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 0 0 0 0
VID4 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 0 0 0 0
VID3 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1
VID2 0 0 0 1 1 1 1 0 0 0 0 1 1 0 0 0 1 1 1 1 0 0
VID1 0 1 1 0 0 1 1 0 0 1 1 0 0 0 1 1 0 0 1 1 0 0
VID0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 1
VCC (V) 0.9000 0.8875 0.8750 0.8625 0.8500 0.8375 0.8250 0.8125 0.8000 0.7875 0.7750 0.7625 0.7500 1.0000 0.9875 0.9750 0.9625 0.9500 0.7375 0.7250 0.7125 0.7000
The VID specification for the processor is defined by the RS - Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines. The processor uses seven voltage identification pins, VID[6:0], to support automatic selection of power supply voltages. The VID pins for processor are CMOS outputs driven by the processor VID circuitry. Table 3-2 specifies the voltage level corresponding to the state of VID[6:0]. A "1" in this refers to a high-voltage level and a "0" refers to low-voltage level. For more details about VR design to support the processor power supply requirements, Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines. VRD11 has 8 VID pins (VID[7:0]) compared to 7 VID pins for the processor. VRD11 VID[n] should be connected to processor VID[n-1]. VRD11 VID[0] should be tied to Vss.
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Electrical Specifications
Table 3. Processor VID Pin to VRD11 VID Pin Mapping
Processor VID Pin 6 5 4 3 2 1 0 Map to VRD11 VID Pin 7 6 5 4 3 2 1 0 (tie to ground)
Power source characteristics must be stable whenever the supply to the voltage regulator is stable.
3.5
Catastrophic Thermal Protection
The processor supports the THERMTRIP# signal for catastrophic thermal protection. An external thermal sensor should also be used to protect the processor and the system against excessive temperature. Even with the activation of THERMTRIP#, which halts all processor internal clocks and activities, leakage current can be high enough such that the processor cannot be protected in all conditions without the removal of power to the processor. If the external thermal sensor detects a catastrophic processor temperature of 125 C (maximum), or if the THERMTRIP# signal is asserted, the VCC supply to the processor must be turned off within 500 ms to prevent permanent silicon damage due to thermal runaway of the processor. THERMTRIP functionality is not ensured if the PWRGOOD signal is not asserted.
3.6
Reserved and Unused Pins
All RESERVED (RSVD) pins must remain unconnected. Connection of these pins to VCCP, VSS, or to any other signal (including each other) can result in component malfunction or incompatibility with future processors. See section Chapter 4.2 for a pin listing of the processor and the location of all RSVD pins. For reliable operation, always connect unused inputs or bidirectional signals to an appropriate signal level. Unused active low AGTL+ inputs may be left as no connects if AGTL+ termination is provided on the processor silicon. Unused active high inputs should be connected through a resistor to ground (VSS). Unused outputs can be left unconnected.
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Electrical Specifications
3.7
FSB Frequency Select Signals (BSEL[2:0])
Only 133 MHz is supported by the processor. The BSEL[2:0] signals need to be set accordingly to select the frequency of the processor input clock (BCLK[1:0]). These signals should be connected to the clock chip and the appropriate chipset on the platform. The BSEL encoding for BCLK[1:0] is shown in Table 3-4.
Table 4. BSEL[2:0] Encoding for BCLK Frequency
BSEL[2] L NOTE: BSEL[1] L BSEL[0] H BCLK Frequency 133 MHz
All other bus selections reserved.
3.8
FSB Signal Groups
To simplify the following discussion, the FSB signals have been combined into groups by buffer type. AGTL+ input signals have differential input buffers, which use GTLREF as a reference level. In this document, the term "AGTL+ Input" refers to the AGTL+ input group as well as the AGTL+ I/O group when receiving. Similarly, "AGTL+ Output" refers to the AGTL+ output group as well as the AGTL+ I/O group when driving. With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals which are dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals which are relative to their respective strobe lines (data and address) as well as the rising edge of BCLK0. Asynchronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 3-5 identifies which signals are common clock, source synchronous, and asynchronous.
Table 5. FSB Pin Groups
Signal Group Type Signals1
AGTL+ Common Clock Synchronous to BPRI#, DEFER#, PREQ#, RESET#, RS[2:0]#, TRDY#, BCLK[1:0] DPWR# Input
AGTL+ Common Clock Synchronous to ADS#, BNR#, BPM[3:0]#, BR0#, DBSY#, DRDY#, HIT#, BCLK[1:0] HITM#, LOCK#, PRDY# I/O Signals Associated Strobe REQ[4:0]#, A[16:3]# ADSTB0# A[32:17]#, ADSTB1# AGTL+ Source Synchronous I/O Synchronous to D[15:0]#, DBI0#, DINV[0]# assoc. strobe D[31:16]#, DBI1#, DINV[0]# D[47:32]#, DBI2#, DINV[0]# D[63:48]#, DBI3#, DINV[0]# DSTBP0#, DSTBN0# DSTBP1#, DSTBN1# DSTBP2#, DSTBN2# DSTBP3#, DSTBN3#
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Electrical Specifications
Signal Group AGTL+ Strobes
Type
Signals1
Synchronous to ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]# BCLK[1:0] Asynchronous Asynchronous Asynchronous Asynchronous IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, PWRGOOD, SMI# FERR#, IERR#, THERMTRIP# PROCHOT#3 VID[6:0], BSEL[2:0]
CMOS Input Open Drain Output Open Drain I/O CMOS Output CMOS Input Open Drain Output FSB Clock Power/Other
Synchronous to TCK, TDI, TMS, TRST# TCK Synchronous to TDO TCK Clock BCLK[1:0] COMP[3:0], HFPLL (old name is DBR#2), GTLREF, TEST2/Dclk, TEST1/Aclk, THERMDA, THERMDC, VCCA, VCCP, VTT, VCC_SENSE, VSS, VSS_SENSE, VCCQ[1:0]
NOTES: 1. 1. In processor systems where there is no debug port implemented on the system board, these signals are used to support a debug port interposer. In systems with the debug port implemented on the system board, these signals are no connects. 2. 2. PROCHOT# signal type is open drain output and CMOS input. 3. 3. On die termination differs from other AGTL+ signals, refer to your Platform Design Guidelines for up to day recommendations.
3.9
CMOS Asynchronous Signals
CMOS input signals are shown in Table 3-5. Legacy output FERR#, IERR# and other non- AGTL+ signals (THERMTRIP# and PROCHOT#) use Open Drain output buffers. These signals do not have setup or hold time specifications in relation to BCLK[1:0]. However, all of the CMOS signals are required to be asserted for more than 4 BCLKs for the processor to recognize them. See Section 3.11 and Section for the DC and AC specifications for the CMOS signal groups.
3.10
3.10 Maximum Ratings
Table 3-6 specifies absolute maximum and minimum ratings. Within functional operation limits, functionality and long-term reliability can be expected. At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long term reliability can be expected. If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these limits, but within the absolute maximum and minimum ratings, the device may be functional, but with its lifetime degraded depending on exposure to conditions exceeding the functional operation condition limits.
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Electrical Specifications
At conditions exceeding absolute maximum and minimum ratings, neither functionality nor long term reliability can be expected. Moreover, if a device is subjected to these conditions for any length of time then, when returned to conditions within the functional operating condition limits, it will either not function or its reliability will be severely degraded. Although the processor contains protective circuitry to resist damage from static electric discharge, precautions should always be taken to avoid high static voltages or electric fields. Table 6. Processor Absolute Maximum Ratings
Symbol TSTORAGE VCC VinAGTL+ VinAsynch_CMOS Parameter Processor Storage Temperature Any Processor Supply Voltage with Respect to VSS AGTL+ Buffer DC Input Voltage with Respect to VSS CMOS Buffer DC Input Voltage with Respect to VSS Min -40 -0.3 -0.1 -0.1 Max 85 1.55 1.55 1.55 Unit C V V V Notes1,5 2,3,4 6
NOTES: 1. 1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must be satisfied. 2. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect the long term reliability of the device. For functional operation, refer to the processor case temperature specifications. 3. This rating applies to the processor and does not include any tray or packaging. 4. Failure to adhere to this specification can affect the long term reliability of the processor. 5. Overshoot and undershoot guidelines for input, output, and I/O signals are in Chapter 4. 6. The VCC max supported by the process is 1.2 V but the parameter can change (burnin voltage is higher).
3.11
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads) unless noted otherwise. See Chapter 4 for the pin signal definitions and signal pin assignments. Most of the signals on the FSB are in the AGTL+ signal group. The DC specifications for these signals are listed in Table 3-9. DC specifications for the CMOS group are listed in Table 3-10. Table 3-9 through Table 3-11 list the DC specifications for the Intel(R) AtomTM processor and are valid only while meeting specifications for junction temperature, clock frequency, and input voltages. Unless specified otherwise, all specifications for the Intel(R) AtomTM processor are at TJ = 90C. Care should be taken to read all notes associated with each parameter.
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Electrical Specifications
Table 7. Voltage and Current Specifications for the Intel(R) AtomTM Processor
Symbol FSB Frequency VTT VCCP VCCA VCC BOOT BCLK Frequency FSB AGTL+ termination voltage with respect to VSS Vcc Core voltage with respect to VSS PLL Supply voltage Default VCCP voltage for initial power up ICC for VTT supply after VCCP stable ICC for VTT supply at startup ICC for Intel(R) AtomTM Processors Recommended Design Target (Estimated) ICC for Intel(R) AtomTM Processors ICC Processor Number 230 IAH ICCA ICC Auto-Halt ICC for VCCA Supply Core Frequency 1.6 GHz @ VCCP (AVID controlled) 4 2.0 130 A A mA 1, 2 1, 2 Parameter Min 132.6 Typ 133.33 Max 133.5 Unit MHz Notes6
1.05 0.7 1.425 1.10
1.10
1.15 1.2
V V V V 10 7,8
1.5
1.575 1.2 1.5 2.5
ITT
A
3
ICCDES
4
A
3
NOTES: 1. Specified at 90C TJ. 2. Specified at the nominal VCCP. 3. Refer to the RS - Voltage Regulator-Down (VRD) 11.0 - Processor Power Delivery Design Guidelines for design target capability. 4. Measured at the bulk capacitors on the motherboard. 5. Based on simulations and averaged over the duration of any change in current. Specified by design/ characterization at nominal VCCP. Not 100% tested. 6. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date. 7. VCCP is determined by processor VID[6:0] pins. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within VID range. Refer to VID Table 3-2 for the specific voltages corresponding to VID[6:0] codes. 8. This is the Vccp range, not the absolute voltage set for the core. The Vccp tolerance should be +/- 50 mV, inclusive of ripple, VR tolerance and transient (droop and overshoot). 9. Since CPU is soldered down with no loadline and no dynamic VID, there is no "socket load line slope(SKT_LL)"; "socket load line tolerance band" but only "Tolerance Band (TOB)" of 50mV; no "maximum overshoot above VID (OS_AMP)"; no "maximum overshoot time duration above VID (OS_TIME)"; no "peak to peak ripple amplitude (RIPPLE)"; no "thermal compensation voltage drift (THERMAL_DRIF)"; no "maximum DC test (Current I_DC_MAX)"; no "minimum DC test (Current
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Electrical Specifications
10.
I_DC_MIN)"; "Voltage Regulator Thermal Design Current (VR_TDC_)" of 3.64A; "current step rise time (I_RISE) of 2.5 A/us". 50 mV tolerance
Table 8. FSB Differential BCLK Specifications
Symbol VIH VIL VCROSS VCROSS VSWING ILI Cpad Parameter Input High Voltage Input Low Voltage Crossing Voltage Range of Crossing Points Differential Output Swing Input Leakage Current Pad Capacitance 300 -5 1.2 1.45 +5 2.0 0.3 Min Typ Max 1.15 -0.3 0.55 140 Unit V V V mV mV A pF Figure Notes1 7, 8 7, 8 2, 7, 9 2, 7, 5 6 3 4
NOTES: 1. 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. Crossing Voltage is defined as absolute voltage where rising edge of BCLK0 is equal to the falling edge of BCLK1. 3. For Vin between 0 V and VIH. 4. Cpad includes die capacitance only. No package parasitics are included. 5. VCROSS is defined as the total variation of all crossing voltages as defined in note 2. 6. Measurement taken from differential waveform. 7. Measurement taken from single-ended waveform. 8. "Steady state" voltage, not including Overshoots or Undershoots. 9. Only applies to the differential rising edge (clock rising and clock# falling).
Table 9. AGTL+/CMOS Signal Group DC Specifications
Symbol VTT GTLREF Parameter I/O Voltage GTL Reference Voltage Min 1.05 Typ 1.10 2/3 VTT 0.62 VTT RCOMP Compensation Resistor COMP[0] & COMP[2] COMP[1] & COMP[3] RODT VIH VIL VOH RTT RON (GTL mode) ILI Termination Resistor Input High Voltage Input Low Voltage Output High Voltage Termination Resistance GTL Buffer on Resistance Input Leakage Current GTLREF+0.10 -0.10 VTT-0.10 45 Max 1.15 Unit V V Notes1 11 5, 12,13
24.75 49.5
25 50 55 VTT 0 VTT 50 8.5
25.25 50.5

9, 11 10 3,5 2,4 5 6
VTT+0.10 GTLREF-0.10 VTT 55
V V V
100
A
7
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Electrical Specifications
Symbol Cpad
Parameter Pad Capacitance
Min 1.8
Typ 2.1
Max 2.75
Unit pF
Notes1 8
NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value. 3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value. 4. VIH and VOH may experience excursions above VTT. However, input signal drivers must comply with the signal quality specifications. 5. GTLREF should be generated from VTT with a 1% tolerance resistor divider. The VTT referred to in these specifications is the instantaneous VTT. Please refer to latest Nettop'08 Platform Design Guide for GTLREF settings. 6. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Measured at 0.31*VTT. RTT is connected to VTT on die. Refer to processor I/O buffer models for I/V characteristics. 7. Specified with on die RTT and RON are turned off. Vin between 0 and VTT. 8. Cpad includes die capacitance only. No package parasitics are included. 9. This is the external resistor on the comp pins. 10. On die termination resistance, measured at 0.33*VTT. 11. RCOMP resistance must be provided on the system board with 1% resistors. 12. Refer to platform design guide for platform specific GTLREF value. 13. 2/3 VTT for paring with SiS 671 chipset and 0.62 VTT for pairing with Intel 945GC chipset.
Table 10. Legacy CMOS Signal Group DC Specifications
Symbol VTT VIH VIL VOH VOL IOH IOL ILI Cpad1 Cpad2 Parameter I/O Voltage Input High Voltage Input Low Voltage CMOS Output High Voltage Output Low Voltage Output High Current Output Low Current Input Leakage Current Pad Capacitance Pad Capacitance for CMOS Input NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 1.6 0.95 2.1 1.2 Min 1.05 0.7*VTT -0.10 0.9*VTT -0.10 1.5 1.5 Typ 1.10 VTT 0.00 VTT 0 Max 1.15 VTT+0.1 0.3*VTT VTT+0.1 0.1*VTT 4.1 4.1 100 2.55 1.45 Unit V V V V V mA mA A pF 2 2, 3 2 2 5 4 6 7 8 Notes1
Unless otherwise noted, all specifications in this table apply to all processor frequencies. The VTT referred to in these specifications refers to instantaneous VTT. Refer to the processor I/O Buffer Models for I/V characteristics. Measured at 0.1*VTT. Measured at 0.9*VTT. For Vin between 0V and VTT. Measured when the driver is tri-stated. Cpad1 includes die capacitance only for DPRSTP#, DPSLP#, PWRGOOD. No package parasitics are included. Cpad2 includes die capacitance for all other CMOS input signals. No package parasitics are included.
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Electrical Specifications
Table 11. Open Drain Signal Group DC Specifications
Symbol VOH VOL IOL ILO Cpad Parameter Output High Voltage Output Low Voltage Output Low Current Output Leakage Current Pad Capacitance 1.9 2.2 Min VTT-5% 0 16 Typ VTT Max VTT+5% 0.20 50 200 2.45 Unit V V mA A pF 2 4 5 Notes1 3
NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. Measured at 0.2 V. 3. VOH is determined by value of the external pull-up resistor to VTT. Refer to platform design guide for details. 4. For Vin between 0 V and VOH. 5. Cpad includes die capacitance only. No package parasitics are included.
3.12
AGTL+ FSB Specifications
Routing topology recommendations may be found in the appropriate platform design guides. Termination resistors are not required for most AGTL+ signals, as these are integrated into the processor silicon. Valid high and low levels are determined by the input buffers which compare a signal's voltage with a reference voltage called GTLREF (known as VREF in previous documentation). Table 3-9 lists the GTLREF specifications. The AGTL+ reference voltage (GTLREF) should be generated on the system board using high precision voltage divider circuits. It is important that the system board impedance is held to the specified tolerance, and that the intrinsic trace capacitance for the AGTL+ signal group traces is known and well- controlled. For more details on platform design, see the appropriate platform design guides.
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Package Mechanical Specifications and Ball Information
4
Package Mechanical Specifications and Ball Information
This chapter provides the package specifications, pinout assignments, and signal description.
4.1
Package Mechanical Specifications
The processor will be available in 512 kB, 437 pins in FCBGA8 package.
4.1.1
Package Mechanical Drawings
Figure 2. Package Mechanical Drawing
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Package Mechanical Specifications and Ball Information
4.1.2
Package Loading Specifications
Package loading is 5lb max static compressive.
4.1.3
Processor Mass Specifications
Processor mass is 1.4g.
4.1.4
Processor Pinout Assignment
Figure 4-3 and Figure 4-4 are graphic representations of the processor pinout assignments. Table 4-12 lists the pinout by signal name.
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Figure 3. Pinout Diagram (Top View, Left Side)
1 A B C D E F G H J K L M N P R T U V W Y AA VSS RSVD VSS D[53]# D[50]# VSS D[46]# D[47]# VSS DINV[2] VSS D[35]# D[34]# VSS COMP[0] D[19]# VSS VSS VSS 2 VSS VSS D[48]# D[63]# DSTBN[3] D[57]# D[49]# D[41]# D[45]# DSTBN[2] D[43]# D[36]# D[42]# D[37]# D[33]# COMP[1] D[27]# D[30]# D[25]# VSS VSS 3 RSVD D[60]# D[55]# D[51]# VSS DSTBP[3] D[40]# VSS D[38]# DSTBP[2] VSS D[44]# D[39]# VSS D[32]# D[28]# VSS D[26]# D[18]# D24[]# VSS 4 VSS D[52]# D[61]# RSVD THRMDA VSS VSS VSS IGNNE# NC VSS RSVD VSS VSS RSVD VSS DPWR# VSS D[31]# DSTBN[1] VSS 5 D[54]# VSS DINV[3] VSS THRMDC VSS BSEL[2] BSEL[1] VSS NC VSS VSS VSS VSS VSS VSS RSVD RSVD VSS DSTBP[1] D[16]# 6 D[56]# D[59]# D[58]# NC VSS VSS NC NC BSEL[0] VSS VSS EXTBGREF RSVD VSS RSVD RSVD VSS VSS D[21]# DINV[1] D[23]# 7 GTLREF CMREF D[62]# VCCA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS D[20]# D[22]# VSS 8 VSS VSS VSS VSS VSS VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VSS VSS D[17]# D[29]# 9 VCCQ0 VCCQ0 VTT VTT VTT VTT VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VTT RSVD D[15]# D[8]# D[14]# 10 VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VSS VTT VTT D[1]# D[7]# VSS 11 VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VSS VTT BCLK[0] VSS D[0]# D[4]# A B C D E F G H J K L M N P R T U V W Y A A
1
2
3
4
5
6
7
8
9
10
11
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Package Mechanical Specifications and Ball Information
Figure 4. Pinout Diagram (Top View, Right Side)
12 A B VCCP VCCP 13 RSVD VSS 14 A[35]# A[33]# 15 VSS A[34]# 16 A[20]# A[29]# 17 A[32]# A[30]# 18 VSS A[27]# 19 VSS ADSTB[1 ]# A[17]# A[21]# VSS A[18]# REQ[2]# VSS A[7]# A[14]# VSS A[10]# A[8]# VSS 20 VSS VSS VSS 21 A B
C D E F G H J K L M N P R T U V W Y AA
VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VCCP VSS VTT BCLK[1] D[5]# D[2]# VSS
VCCSENSE VSSSENSE VTT VTT VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VTT VSS D[13]# D[9]# D[11]#
A[22]# VSS VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VSS VSS DSTBN[0] D[3]#
A[28]# RESET# VSS VID[0] VID[3] BPM[2]# BPM[3]# VSS VSS NC FORCEPR# VSS LINT1 LINT0 VSS BR1# D[10]# DSTBP[0] VSS
A[31]# VID[1] VSS IERR# VID[4] VSS PREQ# TRST# NC TDO TDI VSS STPCLK# FERR# VSS INIT# DINV[0] D[12]# D[6]#
VSS RSVD VID[5] VSS PROCHOT# RSVD VSS BPM[0]# TMS TCK VSS RSVD DPSLP# RSVD SMI# PWRGOOD VSS RS[1]# HIT#
A[23]# VSS VID[2] VSS VID[6] VSS BPM[1]# PRDY# VSS RSVD SLP# VSS
A[24]# A[26]# A[25]# COMP[2] A[9]# A[4]# A[15]# ADSTB[0]# A[12]# A[13]# A[5]# REQ[3]# A[6]# BR0# RS[2]# HITM# LOCK# VSS VSS
RSVD VSS A[19]# COMP[3] VSS A[11]# REQ[1]# VSS A[16]# VSS
C D E F G H J K L M
REQ[0]# N A[3]# VSS DEFER# BPRI# VSS VSS VSS P R T U V W Y A A 21
DPRSTP# REQ[4]# VSS A20M VSS RS[0]# DBSY# VSS DRDY# VSS ADS TRDY# BNR# VSS
12
13
14
15
16
17
18
19
20
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Package Mechanical Specifications and Ball Information
Table 12. Pinout Arranged By Signal Name
Signal Name A[10]# A[11]# A[12]# A[13]# A[14]# A[15]# A[16]# A[17]# A[18]# A[19]# A[20]# A[21]# A[22]# A[23]# A[24]# A[25]# A[26]# A[27]# A[28]# A[29]# A[3]# A[30]# A[31]# A[32]# A[33]# A[34]# A[35]# A[4]# A[5]# A[6]# A[7]# A[8]# A[9]# A20M# RSVD ADS# ADSTB[1]# Ball # M19 H21 L20 M20 K19 J20 L21 C19 F19 E21 A16 D19 C14 C18 C20 E20 D20 B18 C15 B16 P21 B17 C16 A17 B14 B15 A14 H20 N20 R20 J19 N19 G20 U18 U5 V19 B19 Signal Name BCLK[0] BCLK[1] BNR# BPM[0]# BPM[1]# BPM[2]# BPM[3]# BPRI# BR0# BR1# BSEL[0] BSEL[1] BSEL[2] COMP[0] COMP[1] COMP[2] COMP[3] D[0]# D[1]# D[10]# D[11]# D[12]# D[13]# D[14]# D[15]# D[16]# D[17]# D[18]# D[19]# D[2]# D[20]# D[21]# D[22]# D[23]# D[24]# D[25]# D[27]# Ball # V11 V12 Y19 K17 J18 H15 J15 U21 T20 V15 J6 H5 G5 T1 T2 F20 F21 Y11 W10 W15 AA13 Y16 W13 AA9 W9 AA5 Y8 W3 U1 Y12 W7 W6 Y7 AA6 Y3 W2 U2 Signal Name D[28]# D[29]# D[3]# D[30]# D[31]# D[32]# D[33]# D[34]# D[35]# D[36]# D[37]# D[38]# D[39]# D[4]# D[40]# D[41]# D[42]# D[43]# D[44]# D[45]# D[46]# D[47]# D[48]# D[49]# D[5]# D[50]# D[51]# D[52]# D[53]# D[54]# D[55]# D[56]# D[57]# D[58]# D[59]# D[6]# D[61]# Ball # T3 AA8 AA14 V2 W4 R3 R2 P1 N1 M2 P2 J3 N3 AA11 G3 H2 N2 L2 M3 J2 H1 J1 C2 G2 W12 F1 D3 B4 E1 A5 C3 A6 F2 C6 B6 AA16 C4 Signal Name D[62]# D[63]# D[7]# D[8]# D[9]# DBSY# RSVD DEFER# DINV[0]# DINV[1]# DINV[2]# DINV[3]# DPRSTP# DPWR# DRDY# DSTBN[0]# DSTBN[1]# DSTBN[2]# DSTBN[3]# DSTBP[0]# DSTBP[1]# DSTBP[2]# DSTBP[3]# FERR# FORCEPR# GTLREF HIT# HITM# IERR# IGNNE# INIT# LINT0 LINT1 LOCK# RSVD NC NC Ball # C7 D2 Y10 Y9 Y13 Y18 V5 T21 W16 Y6 L1 C5 R18 U4 T19 Y14 Y4 K2 E2 Y15 Y5 K3 F3 T16 N15 A7 AA17 V20 F16 J4 V16 T15 R15 W20 P17 D6 H6
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Package Mechanical Specifications and Ball Information
Signal Name NC NC NC NC PRDY# PREQ# PROCHOT# PWRGOOD REQ[0]# REQ[1]# REQ[2]# REQ[3]# REQ[4]# RESET# RS[0]# RS[1]# RS[2]# RSVD DPSLP# RSVD RSVD CMREF RSVD RSVD RSVD RSVD RSVD RSVD RSVD VTT VTT VTT VTT SLP# SMI# STPCLK# TCK TDI VSS
Ball # K4 K5 M15 L16 K18 J16 G17 V17 N21 J21 G19 P20 R19 D15 W18 Y17 U20 D17 R17 M18 T17 B7 A13 R6 N6 T6 A3 C1 C21 E13 E14 F13 F14 N18 U17 R16 M17 N16 J5
Signal Name TD EXTBGREF THERMTRIP# THRMDA THRMDC TMS TRDY# TRST# VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VSS VSS VSS VCC
Ball # M16 M6 H17 E4 E5 L17 W19 K16 A10 A11 A12 B10 B11 B12 C10 C11 C12 D10 D11 D12 E10 E11 E12 F10 F11 F12 G10 G11 G12 H10 H11 H12 J10 J11 J12 P4 P5 P6 K11
Signal Name VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCCA VTT VCCQ0 VCCQ0 VCCSENSE VID[0] VID[1] VID[2] VID[3] VID[4] VID[5] VID[6] VSS VSS VSS VSS VSS RSVD VSS VSS VSS VSS VSS VSS
Ball # L10 L11 L12 M10 M11 M12 N10 N11 N12 P10 P11 P12 R10 R11 R12 D7 V10 A9 B9 C13 F15 D16 E18 G15 G16 E17 G18 A2 A4 A8 A15 A18 A19 A20 B1 V8 V13 V14 V18
Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VTT VTT VTT VTT
Ball # B13 B20 B21 C8 C17 D1 D5 D8 D14 D18 D21 E3 E6 E7 E8 E15 E16 E19 F4 F5 F6 F7 F17 F18 G1 G4 G7 G9 G13 G21 H3 H4 H7 H9 H13 H14 J8 J14 K8
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Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS RSVD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
Ball # J7 J9 J13 J17 K1 K6 K7 K9 K13 K15 K21 L3 L4 L5 L6 L7 L9 L13 L15 L18 L19 M1 M5 M7 M9 M13 M21 N4 N5 N7 N9 N13 N17 P3
Signal Name VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
Ball # K12 P7 P9 P13 P15 P16 P18 P19 R1 R5 R7 R9 R13 R21 T4 T5 T7 T9 T10 T11 T12 T13 T18 U3 U6 U7 U15 U16 U19 V1 V4 V6 B5 B8
Signal Name VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSSSENSE VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VSS
Ball # V21 W1 W5 W8 W11 W14 W17 W21 Y1 Y2 Y20 Y21 AA2 AA3 AA4 AA7 AA10 AA12 AA15 AA18 AA19 AA20 D13 C9 D9 E9 F8 F9 G8 G14 L14 M8 M14 H18
Signal Name VTT VTT VSS VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT VTT RSVD RSVD RSVD RSVD
Ball # K14 L8 H19 N8 N14 P8 P14 R8 R14 T8 T14 U8 U9 U10 U11 U12 U13 U14 V9 R4 M4 D4
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4.2
Signal Description
Table 13. Signal Description
Signal Name Type Description A[32:3]# (Address) defines a 232-byte physical memory address space. In subphase 1 of the address phase, these pins transmit the address of a transaction. A[32:3]# I/O In sub-phase 2, these pins transmit transaction type information. These signals must connect the appropriate pins of both agents on the Intel(R) AtomTM processor FSB. A[32:3]# are source synchronous signals and are latched into the receiving buffers by ADSTB[1:0]#. Address signals are used as straps which are sampled before RESET# is deasserted. If A20M# (Address-20 Mask) is asserted, the processor masks physical address bit 20 (A20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. Asserting A20M# emulates the 8086 processor's address wraparound at the 1-MB boundary. Assertion of A20M# is only supported in real mode. A20M# is an asynchronous signal. However, to ensure recognition of this signal following an input/output write instruction, it must be valid along with the TRDY# assertion of the corresponding input/ output Write bus transaction. ADS# (Address Strobe) is asserted to indicate the validity of the transaction address on the A[32:3]# and REQ[4:0]# pins. All bus agents observe the ADS# activation to begin parity checking, protocol checking, address decode, internal loop, or deferred reply ID match operations associated with the new transaction. Address strobes are used to latch A[32:3]# and REQ[4:0]# on their rising and falling edges. Strobes are associated with signals as shown below. SignalsAssociated Strobe REQ[4:0]#, A[16:3]#ADSTB[0]# A[32:17]#ADSTB[1]# The differential pair BCLK (Bus Clock) determines the FSB frequency. All FSB agents must receive these signals to drive their outputs and latch their inputs. All external timing parameters are specified with respect to the rising edge of BCLK0 crossing VCROSS. BNR# (Block Next Request) is used to assert a bus stall by any bus agent who is unable to accept new bus transactions. During a bus stall, the current bus owner cannot issue any new transactions. BNR# I/O These are Wired-OR signals. Wired-OR is AGTL common clock I/O. They are signals where both CPU & MCH may possibly driver together, hence no receiver. We would potentially see overshoot and undershoot issue. Therefore, there is a dedicated over/ undershoot specification for Wired-OR signals.
A20M#
I
ADS#
I/O
ADSTB[1:0]#
I/O
BCLK[1:0]
I
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Signal Name BPM[0]# BPM[1]# BPM[2]# BPM[3]#
Type O I/O O I/O
Description BPM[3:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals. They are outputs from the processor which indicate the status of breakpoints and programmable counters used for monitoring processor performance. BPM[3:0]# should connect the appropriate pins of all FSB agents. This includes debug or performance monitoring tools. Refer to the platform design guide for more detailed information. BPRI# (Bus Priority Request) is used to arbitrate for ownership of the FSB. It must connect the appropriate pins of both FSB agents. Observing BPRI# active (as asserted by the priority agent) causes the other agent to stop issuing new requests, unless such requests are part of an ongoing locked operation. The priority agent keeps BPRI# asserted until all of its requests are completed, then releases the bus by deasserting BPRI#. BR0# is used by the processor to request the bus. BSEL[2:0] (Bus Select) are used to select the processor input clock frequency. For Intel(R) AtomTM processor, the BSEL is fixed to operate at 133-MHz BCLK frequency. COMP[3:0] must be terminated on the system board using precision (1% tolerance) resistors. Refer to the platform design guide for more details on implementation. D[63:0]# (Data) are the data signals. These signals provide a 64bit data path between the FSB agents, and must connect the appropriate pins on both agents. The data driver asserts DRDY# to indicate a valid data transfer. D[63:0]# are quad-pumped signals and will thus be driven four times in a common clock period. D[63:0]# are latched off the falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a pair of one DSTBP# and one DSTBN#. The following table shows the grouping of data signals to data strobes and DINV#.
BPRI#
I
BR[1:0]#
I/O
BSEL[2:0]
O
COMP[3:0]
PWR
D[63:0]#
I/O
Quad-Pumped Signal Groups, Data GroupDSTBN#/DSTBP#DINV# D[15:0]#/00 D[31:16]#/11 D[47:32]#/22 D[63:48]#/33 Furthermore, the DINV# pins determine the polarity of the data signals. Each group of 16 data signals corresponds to one DINV# signal. When the DINV# signal is active, the corresponding data group is inverted and therefore sampled active high.
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Signal Name
Type
Description DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on the FSB to indicate that the data bus is in use. The data bus is released after DBSY# is deasserted. This signal must connect the appropriate pins on both FSB agents. DEFER# is asserted by an agent to indicate that a transaction cannot be guaranteed in-order completion. Assertion of DEFER# is normally the responsibility of the addressed memory or Input/ Output agent. This signal must connect the appropriate pins of both FSB agents. DINV[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity of the D[63:0]# signals. The DINV[3:0]# signals are activated when the data on the data bus is inverted. The bus agent will invert the data bus signals if more than half the bits, within the covered group, would change level in the next cycle. DINV[3 0]# Assignment To Data B s SignalData B s Signals DPSLP# when asserted on the platform causes the processor to transition from the Sleep State to the Deep Sleep state. In order to return to the Sleep State, DPSLP# must be deasserted. DPSLP# is driven by the SCH chipset. This signal is not used for Nettop'08 platform and tied to VTT. DPRSTP# when asserted on the platform causes the processor to transition from the Deep Sleep State to the Deeper Sleep state. In order to return to the Deep Sleep State, DPRSTP# must be deasserted. DPRSTP# is driven by the SCH chipset. This signal is not used for Nettop'08 platform and tied to VTT. DPWR# is a control signal from the chipset used to reduce power on the processor data bus input buffers. This signal is not used for Nettop'08 platform and tied to VTT. DRDY# (Data Ready) is asserted by the data driver on each data transfer, indicating valid data on the data bus. In a multi-common clock data transfer, DRDY# may be deasserted to insert idle clocks. This signal must connect the appropriate pins of both FSB agents. Data strobe used to latch in D[63:0]#. Signals Associated Strobe
DBSY#
I/O
DEFER#
I
DINV[3:0]#
I
DPSLP#
I
DPRSTP#
I
DPWR#
I
DRDY#
I/O
DSTBN[3:0]#
I/O
D[15:0]#DINV[0]#, DSTBN[0]# D[31:16]#DINV[1]#, DSTBN[1]# D[47:32]#DINV[2]#, DSTBN[2]# D[63:48]#DINV[3]#, DSTBN[3]# Data strobe used to latch in D[63:0]#. Signals Associated Strobe
DSTBP[3:0]#
I/O
D[15:0]#DINV[0]#, DSTBP[0]# D[31:16]#DINV[1]#, DSTBP[1]# D[47:32]#DINV[2]#, DSTBP[2]# D[63:48]#DINV[3]#, DSTBP[3]#
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Datasheet
Package Mechanical Specifications and Ball Information
Signal Name
Type
Description FERR# (Floating-point Error)/PBE# (Pending Break Event) is a multiplexed signal and its meaning is qualified with STPCLK#. When STPCLK# is not asserted, FERR#/PBE# indicates a floating point when the processor detects an unmasked floating-point error. FERR# is similar to the ERROR# signal on the Intel 387 coprocessor, and is included for compatibility with systems using MSDOS*- type floating-point error reporting. When STPCLK# is asserted, an assertion of FERR#/PBE# indicates that the processor has a pending break event waiting for service. The assertion of FERR#/PBE# indicates that the processor should be returned to the Normal state GTLREF determines the signal reference level for AGTL+ input pins. GTLREF is used by the AGTL+ receivers to determine if a signal is a logical 0 or logical 1. Refer to the platform design guide for details on GTLREF implementation. CMOS signal reference voltage for data and address pin. Since CMOS signaling is not used, this is a no connect. Tie this to GTLREF as defensive design. EXTBGREF should be set at 2/3 VTT with resistor divider network with a 1k // 2k Ohm resistors. HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation results. Either FSB agent may assert both HIT# and HITM# together to indicate that it requires a snoop stall, which can be continued by reasserting HIT# and HITM# together.
FERR#/PBE#
O
GTLREF
PWR
CMREF
PWR
EXTBGREF
PWR
HIT# HITM#
I/O
These are Wired-OR signals. Wired-OR is AGTL common clock I/O. They are signals where both CPU & MCH may possibly driver together, hence no receiver. We would potentially see overshoot and undershoot issue. Therefore, there is a dedicated over/ undershoot specification for Wired-OR signals. IERR# (Internal Error) is asserted by a processor as the result of an internal error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the FSB. This transaction may optionally be converted to an external error signal (e.g., NMI) by system core logic. The processor will keep IERR# asserted until the assertion of RESET#, or INIT#. For termination requirements, refer to the platform design guide. IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a numeric error and continue to execute non-control floatingpoint instructions. If IGNNE# is deasserted, the processor generates an exception on a non-control floating-point instruction if a previous floating-point instruction caused an error. IGNNE# has no effect when the NE bit in control register 0 (CR0) is set. IGNNE# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/ Output Write bus transaction.
IERR#
O
IGNNE#
I
Datasheet
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Package Mechanical Specifications and Ball Information
Signal Name
Type
Description INIT# (Initialization), when asserted, resets integer registers inside the processor without affecting its internal caches or floating-point registers. The processor then begins execution at the power-on Reset vector configured during power-on configuration. The processor continues to handle snoop requests during INIT# assertion. INIT# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output Write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/Output Write bus transaction. INIT# must connect the appropriate pins of both FSB agents. If INIT# is sampled active on the active to inactive transition of RESET#, Intel(R) AtomTM reverses its FSB data and address signals internally to ease mother board layout for systems where the chipset is on the other side of the mother board. D[63:0] => D[0:63] A[32:3] => A[3:32] DINV[3:0]# is also reversed. LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins of all APIC Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a maskable interrupt request signal, and LINT1 becomes NMI, a non-maskable interrupt. INTR and NMI are backward compatible with the signals of those names on the Pentium processor. Both signals are asynchronous. Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI/ INTR or LINT[1:0]. Because the APIC is enabled by default after Reset, operation of these pins as LINT[1:0] is the default configuration.
INIT#
I
LINT[1:0]
I
LOCK#
I/O
Probe Ready signal used by debug tools to determine processor debug readiness. Probe Request signal used by debug tools to request debug operation of the processor. Refer to the platform design guide for more implementation details. Probe Request signal used by debug tools to request debug operation of the processor. Refer to the platform design guide for more implementation details.
PRDY#
O
PREQ#
I
PROCHOT#
As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled. The TCC will remain active until the I/O, O (DP) system deasserts PROCHOT#. For termination requirements, refer to the platform design guide. This signal may require voltage translation on the motherboard. Refer to the platform design guide for more details.
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Datasheet
Package Mechanical Specifications and Ball Information
Signal Name
Type
Description PWRGOOD (Power Good) is a processor input. The processor requires this signal to be a clean indication that the clocks and power supplies are stable and within their specifications. `Clean' implies that the signal will remain low (capable of sinking leakage current), without glitches, from the time that the power supplies are turned on until they come within specification. The signal must then transition monotonically to a high state. PWRGOOD can be driven inactive at any time, but clocks and power must again be stable before a subsequent rising edge of PWRGOOD. The PWRGOOD signal must be supplied to the processor; it is used to protect internal circuits against voltage sequencing issues. It should be driven high throughout boundary scan operation.
PWRGOOD
I
REQ[4:0]#
I/O
REQ[4:0]# (Request Command) must connect the appropriate pins of both FSB agents. They are asserted by the current bus owner to define the currently active transaction type. These signals are source synchronous to ADSTB[0]#.
Asserting the RESET# signal resets the processor to a known state and invalidates its internal caches without writing back any of their contents. For a power-on Reset, RESET# must stay active for at least two milliseconds after VCC and BCLK have reached their RESET# I proper specifications. On observing active RESET#, both FSB agents will deassert their outputs within two clocks. All processor straps must be valid within the specified setup time before RESET# is deasserted. RS[2:0]# (Response Status) are driven by the response agent (the agent responsible for completion of the current transaction), and must connect the appropriate pins of both FSB agents.
RS[2:0]#
I
RSVD
These pins are RESERVED and must be left unconnected on the Reserved/ board. However, it is recommended that routing channels to these No Connect pins on the board be kept open for possible future use. SLP# (Sleep), when asserted in Stop-Grant state, causes the processor to enter the Sleep state. During Sleep state, the processor stops providing internal clock signals to all units, leaving only the Phase-Locked Loop (PLL) still operating. Processors in this state will not recognize snoops or interrupts. The processor will recognize only assertion of the RESET# signal, deassertion of SLP#, and removal of the BCLK input while in Sleep state. If SLP# is deasserted, the processor exits Sleep state and returns to Stop- Grant state, restarting its internal clock signals to the bus and processor core units. If DPSLP# is asserted while in the Sleep state, the processor will exit the Sleep state and transition to the Deep Sleep state. This signal is not used for Nettop'08 platform and tied to VTT.
SLP#
I
Datasheet
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Package Mechanical Specifications and Ball Information
Signal Name
Type
Description SMI# (System Management Interrupt) is asserted asynchronously by system logic. On accepting a System Management Interrupt, the processor saves the current state and enter System Management Mode (SMM). An SMI Acknowledge transaction is issued, and the processor begins program execution from the SMM handler. If SMI# is asserted during the deassertion of RESET# the processor will tristate its outputs. STOP-GRANT state is not supported, therefore this pin is not used. Please refer to Nettop'08 Platform Design Guide for termination requirement. TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port). Refer to the platform design guide for termination requirements and implementation details. TDI (Test Data In) transfers serial test data into the processor. TDI
SMI#
I
STPCLK#
I
TCK
I
TDI
I
provides the serial input needed for JTAG specification support. TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support. The processor protects itself from catastrophic overheating by use of an internal thermal sensor. This sensor is set well above the normal operating temperature to ensure that there are no false trips. The processor will stop all execution when junction temperature exceeds approximately 125 degree Celsius. This is signaled to the system by the THERMTRIP# (Thermal Trip) pin. For termination requirements, refer to the platform design guide. Thermal Diode - Anode
TDO
O
THERMTRIP
O
THRMDA
PWR Thermal Diode - Cathode
THRMDC
PWR TMS (Test Mode Select) is a JTAG specification support signal used by debug tools. Refer to the platform design guide for termination requirements and implementation details. TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive a write or implicit writeback data transfer. TRDY# must connect the appropriate pins of both FSB agents. TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset. Refer to the platform design guide for termination requirements and implementation details.
TMS
I
TRDY#
I
TRST#
I
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Datasheet
Package Mechanical Specifications and Ball Information
Signal Name
Type
Description VCCA provides isolated power for the internal processor core PLLs. Refer to the platform design guide for complete implementation details. Processor core power supply
VCCA
PWR
VCCP
PWR Processor core ground node.
VSS
GND FSB AGTL+ termination voltage with respect to VSS
VTT
PWR VID[6:0] (Voltage ID) pins are used to support automatic selection of power supply voltages (VCC) but these pins are not used in the Nettop'08 platform as the VID is fixed at 1.1V. VCC_SENSE is an isolated low impedance connection to processor core power (VCC). It can be used to sense or measure voltage near the silicon with little noise. VSS_SENSE is an isolated low impedance connection to processor core VSS. It can be used to sense or measure ground near the silicon with little noise. Refer to the platform design guide for termination recommendations and more details.
VID[6:0]
O
VCC_SENSE
O
VSS_SENSE
O
Datasheet
37
Thermal Specifications and Design Considerations
5
Thermal Specifications and Design Considerations
The processor requires a thermal solution to maintain temperatures within operating limits as set forth in Section Thermal Specifications. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components in the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete thermal solution includes both component and system level thermal management features. Component level thermal solutions include active or passive heatsink attached to the exposed processor die. The solution should make firm contact to the die while maintaining processor mechanical specifications such as pressure. A typical system level thermal solution may consist of a system fan used to evacuate or pull air through the system. For more information on designing a component level thermal solution, please refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.3). Alternatively, the processor may be in a fan-less system, but would likely still use a multi-component heat spreader. Note that trading of thermal solutions also involves trading performance.
5.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (Tc) specifications at the corresponding thermal design power (TDP) value listed in Table 5-14. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 1.3). The case temperature is defined at the geometric top center of the processor. Analysis indicates that real applications are unlikely to cause the processor to consume the theoretical maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the TDP indicated in Table 5-14 instead of the maximum processor power consumption. The Intel Thermal Monitor feature is designed to help protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained period of time. For more details on the usage of this feature, refer to Section 5.1.2. In all cases the Intel Thermal Monitor feature must be enabled for the processor to remain within specification.
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Datasheet
Thermal Specifications and Design Considerations
Table 14. Power Specifications for the Processor
Symbol Processor Number Core Frequency and Voltage 1.6 GHz & VCC Parameter Auto Halt Min Thermal Design Power Unit Tc min (C 0 Tc max (C) 85.2 Notes
TDP Symbol PAH
230
4.0 Typ Max 1.0
W Unit W
1, 3, 4
2
NOTES: 1. The TDP specification should be used to design the processor thermal solution. The TDP is not the maximum theoretical power the processor can generate. 2. Not 100% tested. These power specifications are determined by characterization of the processor currents at higher temperatures and extrapolating the values for the temperature indicated. 3. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within specifications. 4. VCC is determined by processor VID[6:0].
The processor incorporates three methods of monitoring die temperature: the Digital Thermal Sensor, Intel Thermal Monitor, and the Thermal Diode. The Intel Thermal Monitor (detailed in Section5.1.2) must be used to determine when the maximum specified processor junction temperature has been reached.
5.1.1
Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is used as a thermal "diode", with its collector shorted to ground. The thermal diode can be read by an off-die analog/digital converter (a thermal sensor) located on the motherboard or a stand-alone measurement kit. The thermal diode may be used to monitor the die temperature of the processor for thermal management or instrumentation purposes but is not a reliable indication that the maximum operating temperature of the processor has been reached. When using the thermal diode, a temperature offset value must be read from a processor MSR and applied. See See Section 5.1.2 for thermal diode usage recommendation when the PROCHOT# signal is not asserted. The reading of the external thermal sensor (on the motherboard) connected to the processor thermal diode signals will not necessarily reflect the temperature of the hottest location on the die. This is due to inaccuracies in the external thermal sensor, on-die temperature gradients between the location of the thermal diode and the hottest location on the die, and time based variations in the die temperature measurement. Time based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is slower than the rate at which the TJ temperature can change. Offset between the thermal diode based temperature reading and the Intel Thermal Monitor reading may be characterized using the Intel Thermal Monitor's Automatic mode activation of the thermal control circuit. This temperature offset must be taken into account when using the processor thermal diode to implement power management events. This offset is different than the diode Toffset value programmed into the processor Model Specific Register (MSR).
Datasheet
39
Thermal Specifications and Design Considerations
Table 5-15 and Table 5-16 provide the diode interface and specifications. Transistor model parameters shown in Table 5-16 providing more accurate temperature measurements when the diode ideality factor is closer to the maximum or minimum limits. Contact your external sensor supplier for their recommendation. The thermal diode is separate from the Thermal Monitor's thermal sensor and cannot be used to predict the behavior of the Thermal Monitor. Table 15. Thermal Diode Interface
Signal Name THERMDA THERMDC Pin/Ball Number E4 E5 Signal Description Thermal diode anode Thermal diode cathode
Table 16. Thermal Diode Parameters using Transistor Model
Symbol IFW IE nQ Beta RT NOTES: 1. 2. 3. 4. Series Resistance Parameter Forward Bias Current Emitter Current Transistor Ideality Min 5 5 0.997 0.25 2.79 4.52 1.001 Typ Max 200 200 1.015 0.65 6.24 Unit A A Notes 1 1 2,3,4 2,3 2,5
Intel does not support or recommend operation of the thermal diode under reverse bias. Characterized across a temperature range of 50-100C. Not 100% tested. Specified by design characterization. The ideality factor, nQ, represents the deviation from ideal transistor model behavior as exemplified by the equation for the collector current: I = I * (e qVBE/nQkT -1) where IS = saturation current, q = electronic charge, VBE = voltage across the transistor base emitter junction (same nodes as VD), k = Boltzmann Constant, and T = absolute temperature (Kelvin). The series resistance, RT, provided in the Diode Model Table (Table 5-16) can be used for more accurate readings as needed.
C S
5.
When calculating a temperature based on the thermal diode measurements, a number of parameters must be either measured or assumed. Most devices measure the diode ideality and assume a series resistance and ideality trim value, although are capable of also measuring the series resistance. Calculating the temperature is then accomplished using the equations listed under Table 5-16. In most sensing devices, an expected value for the diode ideality is designed-in to the temperature calculation equation. If the designer of the temperature sensing device assumes a perfect diode, the ideality value (also called ntrim) will be 1.000. Given that most diodes are not perfect, the designers usually select an ntrim value that more closely matches the behavior of the diodes in the processor. If the processor diode ideality deviates from that of the ntrim, each calculated temperature will be offset by a fixed amount. This temperature offset can be calculated with the equation: Terror(nf) = Tmeasured * (1 - nactual/ntrim)
40
Datasheet
Thermal Specifications and Design Considerations
where Terror(nf) is the offset in degrees C, Tmeasured is in Kelvin, nactual is the measured ideality of the diode, and ntrim is the diode ideality assumed by the temperature sensing device.
5.1.2
Intel(R) Thermal Monitor
The Intel Thermal Monitor helps control the processor temperature by activating the TCC (Thermal Control Circuit) when the processor silicon reaches its maximum operating temperature. The temperature at which the Intel Thermal Monitor activates the TCC is not user configurable. Bus traffic is snooped in the normal manner and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active. With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be minor and hence not detectable. An underdesigned thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under designed may not be capable of cooling the processor even when the TCC is active continuously. The Intel Thermal Monitor controls the processor temperature by modulating (starting and stopping) the processor core clocks when the processor silicon reaches its maximum operating temperature. The Intel Thermal Monitor uses two modes to activate the TCC: automatic mode and on-demand mode. If both modes are activated, automatic mode takes precedence. There is only one automatic modes called Intel Thermal Monitor 1 (TM1). This mode is selected by writing values to the MSRs of the processor. After automatic mode is enabled, the TCC will activate only when the internal die temperature reaches the maximum allowed value for operation. The Intel Thermal Monitor automatic mode must be enabled through BIOS for the processor to be operating within specifications. Intel recommends TM1 be enabled on the processors. When TM1 is enabled and a high temperature situation exists, the clocks will be modulated by alternately turning the clocks off and on at a 50% duty cycle. Cycle times are processor speed dependent and will decrease linearly as processor core frequencies increase. Once the temperature has returned to a non-critical level, modulation ceases and TCC goes inactive. A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near the trip point. The duty cycle is factory configured and cannot be modified. Also, automatic mode does not require any additional hardware, software drivers, or interrupt handling routines. Processor performance will be decreased by the same amount as the duty cycle when the TCC is active.
Datasheet
41
Thermal Specifications and Design Considerations
The Intel Thermal Monitor automatic mode must be enabled through BIOS for the processor to be operating within specifications. Intel recommends TM1 be enabled on the processors. TM1 feature is referred to as Adaptive Thermal Monitoring features. The TCC may also be activated via on-demand mode. If bit 4 of the ACPI Intel Thermal Monitor control register is written to a 1, the TCC will be activated immediately independent of the processor temperature. When using on-demand mode to activate the TCC, the duty cycle of the clock modulation is programmable via bits 3:1 of the same ACPI Intel Thermal Monitor control register. In automatic mode, the duty cycle is fixed at 50% on, 50% off, however in on-demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-demand mode may be used at the same time automatic mode is enabled, however, if the system tries to enable the TCC via on-demand mode at the same time automatic mode is enabled and a high temperature condition exists, automatic mode will take precedence. An external signal, PROCHOT# (processor hot) is asserted when the processor detects that its temperature is above the thermal trip point. Bus snooping and interrupt latching are also active while the TCC is active. Besides the thermal sensor and thermal control circuit, the Intel Thermal Monitor also includes one ACPI register, one performance counter register, three MSR, and one I/O pin (PROCHOT#). All are available to monitor and control the state of the Intel Thermal Monitor feature. The Intel Thermal Monitor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#. PROCHOT# will not be asserted when the processor is in the Stop Grant power states; hence, the thermal diode reading must be used as a safeguard to maintain the processor junction temperature within maximum specification. If the platform thermal solution is not able to maintain the processor junction temperature within the maximum specification, the system must initiate an orderly shutdown to prevent damage. If the processor enters one of the above power states with PROCHOT# already asserted, PROCHOT# will remain asserted until the processor exits the Stop Grant power state and the processor junction temperature drops below the thermal trip point. If Intel Thermal Monitor automatic mode is disabled, the processor will be operating out of specification. Regardless of enabling the automatic or on-demand modes, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature of approximately 125C. At this point the. THERMTRIP# signal will go active. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles. When THERMTRIP# is asserted, the processor core voltage must be shut down within the time specified in Chapter 3.
5.1.3
Digital Thermal Sensor
The processor also contains an on die Digital Thermal Sensor (DTS) that can be read via an MSR (no I/O interface). Each core of the processor will have a unique digital thermal sensor whose temperature is accessible via the processor MSRs. The DTS is the preferred method of reading the processor die temperature since it can be located much closer to the hottest portions of the die and can thus more accurately track the die temperature and potential activation of processor core clock modulation via the
42
Datasheet
Thermal Specifications and Design Considerations
Thermal Monitor. The DTS is only valid while the processor is in the normal operating state (the Normal package level low power state). Unlike traditional thermal devices, the DTS will output a temperature relative to the maximum supported operating temperature of the processor (TJ_max). It is the responsibility of software to convert the relative temperature to an absolute temperature. The temperature returned by the DTS will always be at or below TJ_max. Catastrophic temperature conditions are detectable via an Out Of Spec status bit. This bit is also part of the DTS MSR. When this bit is set, the processor is operating out of specification and immediate shutdown of the system should occur. The processor operation and code execution is not ensured once the activation of the Out of Spec status bit is set. The DTS-relative temperature readout corresponds to the Thermal Monitor (TM1) trigger point. When the DTS indicates maximum processor core temperature has been reached, the TM1 hardware thermal control mechanism will activate. The DTS and TM1 temperature may not correspond to the thermal diode reading since the thermal diode is located in a separate portion of the die and thermal gradient between the individual core DTS. Additionally, the thermal gradient from DTS to thermal diode can vary substantially due to changes in processor power, mechanical and thermal attach, and software application. The system designer is required to use the DTS to ensure proper operation of the processor within its temperature operating specifications. Changes to the temperature can be detected via two programmable thresholds located in the processor MSRs. These thresholds have the capability of generating interrupts via the core's local APIC. Refer to the Intel(R) 64 and IA-32 Architectures Software Developer's Manuals for specific register and programming details.
5.1.4
Out of Specification Detection
Overheat detection is performed by monitoring the processor temperature and temperature gradient. This feature is intended for graceful shut down before the THERMTRIP# is activated. If the processor's TM1 are triggered and the temperature remains high, an "Out Of Spec" status and sticky bit are latched in the status MSR register and generates thermal interrupt.
5.1.5
PROCHOT# Signal Pin
An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature has reached its maximum operating temperature. If TM1 is enabled, then the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#. Refer to the Intel(R) 64 and IA-32 Architectures Software Developer's Manuals for specific register and programming details. The processor implements a bi-directional PROCHOT# capability to allow system designs to protect various components from overheating situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components.
Datasheet
43
Thermal Specifications and Design Considerations
Only a single PROCHOT# pin exists at a package level of the processor. When the core's thermal sensor trips, PROCHOT# signal will be driven by the processor package. If TM1 is enabled, PROCHOT# will be asserted. It is important to note that Intel recommends TM1 to be enabled. When PROCHOT# is driven by an external agent, if TM1 is enabled on the core, then the processor core will have the clocks modulated. PROCHOT# may be used for thermal protection of voltage regulators (VR). System designers can create a circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR will cool down as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR and rely on bi-directional PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its TDP. With a properly designed and characterized thermal solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very short periods of time when running the most power intensive applications. An under-designed thermal solution that is not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may cause a noticeable performance loss. Refer to the Voltage Regulation Specification for details on implementing the bidirectional PROCHOT# feature.
44
Datasheet
Debug Tools Specifications
6
Debug Tools Specifications
The ITP-XDP debug port connector is the recommended debug port for platforms using the processor. Contact your Intel representative for more information.
Datasheet
45

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